structural bonding material-全讯5123

◆ high strength, fill gap up to 0.5mm, fast cure.

◆ good solvent resistance.

◆ apply with anaerobic adhesive primer darbond 2764.

◆ designed for bonding rigid substrates including glass, crystal, jewelry and metal, etc.

◆ typically used for bonding ferrites magnet steel for small motors.

◆ one component, high temperature resistance.

◆ high strength and impact resistance.

◆ can be used at 180℃ permanently, intermittent temperature resistance to 220℃.

◆ excellent mechanical and electrical performance, suitable for bonding magnetic cores and various other substrates.

◆ one component, high temperature resistance, wicking grade.

◆ high strength, impact and pealing resistance.

◆ can be used at 180℃ permanently, intermittent temperature resistance to 220℃.

◆ typically used for bonding magnetic cores and various composite substrates.

ep-1505 structural adhesive epoxy (composite material)

◆ one component.

◆ high strength and impact resistance.

◆ typically used for bonding fiber composite materials.

ep-05 structural adhesive epoxy (fast cure to fix)

◆ two component, fix in 5 minutes.

◆ excellent mechanical strength.

◆ used for bonding various substrates instantly, including metal, ceramic, wood, and glass etc.

◆ cure at low temperature, suitable for emergency repair.

ep-30 structural adhesive epoxy (general purpose)

◆ two component, general purpose.

◆ high bonding strength ,impact and aging resistance

◆ used for bonding various materials.

◆ two component, room temperature cure.

◆ high peeling strength, super flexible, good impact resistance.

◆ firm adhesion, high bonding strength, suitable for large area brush laying.

◆ used for laying metal, laminate floor and plastic rubber floor for railway cabin. bond surface material including fabric, blanket, decorative sheet, sheet metal etc. to base.

2495 cyanoacrylate adhesive

◆ general purpose, medium to low viscosity.

◆ ideal for filling gaps 0.1mm.

◆ used for bonding various materials including rubber and plastic.